TSP800R Thermal Pad Series
Thermal conductivity 8.0W/mK
High thermal conductivity
Excellent conformability, low hardness
High electrical insulation
Excellent softness
High heat dissipation performance and cost-effectiveness
Showing 17–22 of 22 results
Thermal conductivity 8.0W/mK
High thermal conductivity
Excellent conformability, low hardness
High electrical insulation
Excellent softness
High heat dissipation performance and cost-effectiveness
Thermal conductivity=5.0W/mk or customized .
High thermal conductivity, low thermal resistance.
Smal Young moduius ,Soft, relieving stress and shock mitigation.
Can be dispened through a variety of manyal orautomated process.
Good electrical insulation performance and temperature resistance.
Thermal conductivity=4.0W/mk or customized .
High thermal conductivity, low thermal resistance.
Smal Young moduius ,Soft, relieving stress and shock mitigation.
Can be dispened through a variety of manyal orautomated process.
Good electrical insulation performance and temperature resistance.
Thermal conductivity=3.0W/mk or customized .
High thermal conductivity, low thermal resistance.
Smal Young moduius ,Soft, relieving stress and shock mitigation.
Can be dispened through a variety of manyal orautomated process.
Good electrical insulation performance and temperature resistance.
Thermal conductivity=2.0W/mk or customized .
High thermal conductivity, low thermal resistance.
Smal Young moduius ,Soft, relieving stress and shock mitigation.
Can be dispened through a variety of manyal orautomated process.
Good electrical insulation performance and temperature resistance.
Thermal conductivity=1.0W/mk or customized .
High thermal conductivity, low thermal resistance.
Smal Young moduius ,Soft, relieving stress and shock mitigation.
Can be dispened through a variety of manyal orautomated process.
Good electrical insulation performance and temperature resistance.