TSP300R Thermal Pad

Thermal conductivity 3.0W/mK

High thermal conductivity

Excellent conformability, low hardness

High electrical insulation

Excellent softness

High heat dissipation performance and cost-effectiveness

Data Sheet(PDF)

描述

The TSP300R series of thermal pad have flexiblity, execelent insulating property, compressibilityand naturalsurface viscosity.lt is used to fil the gap and realize the thermal conductivity betweenthe heating parts andcooling parts.and also has insulation and shock absorption effects, meanwhile ,it can meet the designrequirements for miniaturization and ultra-thin of equipmentwith excelent manufacturability and practicability .Available for widely thickness ranges and usedin electrical and electronic products .

Features of TSP300R series thermal conductive pad:

1.Efficient thermal conductivity.
2.Super good fit and low hardness.
3.Electrical insulation
4.Excellent softness

Properties	TSP-300R Thermal Pad	—-
Color	Purple(Or Customized）	Visual
Thermal Conductivity	3.0±0.2(Or Customized）	W/mK
Hardness	30	Shore C
Thickness	0.3-12	mm
Continuous Use Temp	-40~150	℃
Size	Or Customized	—

Typical Applications

1.Optoelectronics industry (flat panel displays, LCD-TV, TFT-LCD, built-in power module, backlight module, LED lighting equipment)
2.Computer industry (notebook computers, computer peripherals related equipment, PC hosts, workstations, network servers, PC servers)
3.Network industry (switches, hubs, network cards, modems, transmission equipment)
4.Household appliance industry (water dispensers, induction cookers, air conditioning)
5.Other industries (semiconductor lighting equipment, testing/control medical instruments, power modules)
6.New energy electric batteries;