TSP500R Thermal Pad

描述

TSP500R series thermal conductive silicone pads have flexibility, excellent insulation, compressibility and natural surface viscosity. They are used to fill the gaps between heating components and heat dissipation components to achieve heat conduction. They also play the role of insulation and shock absorption. At the same time, they meet the design requirements of miniaturization and ultra-thinness of equipment. They have excellent processability and practicality, and are suitable for a wide range of thicknesses. They are used for PC, IC, CPU, semiconductors, M/B, P/S, radiators, LCD-TV, laptops, wireless hubs, DDR-II modules, power supplies, mobile phones, high-speed railways, TVs, servers, routers, power batteries, drones, LEDs, monitoring, smart wearable devices, 5G base stations, etc.

Features of TSP500R series thermal conductive pad:

1.Efficient thermal conductivity.
2.Super good fit and low hardness.
3.Electrical insulation
4.Excellent softness

Typical Applications

1.Optoelectronics industry (flat panel displays, LCD-TV, TFT-LCD, built-in power module, backlight module, LED lighting equipment)
2.Computer industry (notebook computers, computer peripherals related equipment, PC hosts, workstations, network servers, PC servers)
3.Network industry (switches, hubs, network cards, modems, transmission equipment)
4.Household appliance industry (water dispensers, induction cookers, air conditioning)
5.Other industries (semiconductor lighting equipment, testing/control medical instruments, power modules)
6.New energy electric batteries;