Description
TSPDC1030 Two-component thermal conductive gel is an essential material for modern electronic devices, offering efficient heat management and superior performance. Whether used in advanced technology or industrial equipment, this product is an indispensable part of thermal solutions.
Key Features of TSPDC1030 Thermal Conductive Gel
- Excellent Thermal Conductivity
With high thermal conductivity values, it ensures efficient heat transfer, protecting sensitive components from overheating. - Low Thermal Resistance
Its soft and flexible nature fills micro-level gaps, reducing thermal resistance for better performance. - Two-Component System
Offers easy mixing and curing for precise applications, ensuring customized consistency and performance. - Electrical Insulation
Provides reliable insulation to protect electronic components from electrical interference. - Long-Term Stability
Resistant to aging, it maintains performance over extended periods under high temperatures or challenging environments.
Product Models | TSPDC-1030 | Unit | Test Standard | |
Color | Component A | White | —— | Visual |
Component B | Gray | —— | Visual | |
After Mining | Offwhite | —— | Visual | |
Density | ≤2.5 | g/cc | ASTM D792 | |
Mixing Ratio | 1:1 | —— | Mass ratio | |
Extrusion Rate | 180@90Psi | g/min | —— | |
Minimum Filling Gap | ≤0.1 | mm | —— | |
UL Flammability Rating | V-0 | —— | UL-94 | |
Continuous Use Temperature | -40-±200 | ℃ | EN334 | |
Thermal Conductivity | 4 | W/m-k | ASTM D5470 | |
Thermal Resistance/1MM | ≤1.0 @20psi |
°Cin2/W | ASTM D5470 | |
Breakdowm Voltage | ≥10 | kv/mm | ASTM D149 | |
Volume Resistivity | ≥1012 | Ω.cm | ASTM D257 |
Typical Applications
1. Semiconductor blocks and various heat sinks, as well as various heat sinks for computers, tablets, and smartphones.
2. Used for LED lighting fixtures and luminous bodies.
3. High performance central processing unit and display card processor.
4. Large communication equipment and surrounding supporting equipment; Base station antenna device.
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