With the continuous updating of electronic devices, the performance requirements for all aspects of equipment and devices are getting higher and higher. At the same time, high-performance electronic devices will also emit more heat when working. How to solve the temperature drop to ensure that the electronic devices can operate at high speed is crucial. Then we need to use heat dissipation materials. Among them, the more common heat dissipation materials are thermal grease, thermal pads and thermal silicone gel. The heat dissipation performance of thermal silicone grease is unquestionable. Low thermal resistance, ultra-thin interface, and excellent electrical insulation performance are all difficult for traditional thermal pads to match. However, the shortcomings of thermal silicone grease such as easy volatility, free drying and unfriendly operation are also headaches for many engineers. The advent of thermal silicone gel has solved the above problems very well. Thermal silicone gel is generally a two-component thermal conductive material. After being extruded by static mixing, it can be injected into irregular components due to its good thixotropy, such as various chamfers, gaps, etc. Compared with the screen or brush coating of thermal silicone grease, it greatly improves the process efficiency; at the same time, thermal silicone gel is a gel state with a certain adsorption force, and there will be no quality risks such as oiling and drying.
Thermally conductive gel inherits the advantages of silicone materials such as good affinity, weather resistance, high and low temperature resistance, and good insulation. At the same time, it has strong plasticity and can meet the filling of uneven interfaces and the heat transfer requirements of various applications. It has high thermal conductivity, low compression force application, low stress, high compression ratio, high electrical insulation, good temperature resistance, and can be used automatically.